In the coming weeks, different Team Duct Tape members will be sharing their team experiences here on our website. This week, Ryder shares a bit about the team’s recent outreach at the Interservice/Industry Training, Simulation and Education Conference (I/ITSEC)


TDT members with Rockwell Collins representative at I/ITSEC

On Dec 7th three members of Team Duct Tape attended an outreach event at the I/ITSEC modeling, simulation, and training conference in Orlando FL. It is the world’s largest conference of it’s kind. The exhibitors included companies like Lockheed Martin, Rockwell Collins, Oculus VR, Fidelity Technologies, and hundred’s more.

For part of the time we worked in the FIRST booth talking to visitor about FIRST robotics and our team.

The rest of the time we got walk around and look at the other exhibits, try out some of the simulation’s, and have fun.

Jacob explaining the engineering notebook

Team members also got to meet with Rockwell Collins representatives and thank them in person for their generous donation at the start of the season.  All in all, it was a fun and successful outreach opportunity.


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